Introduction to plasma etching machine:

Plasma etching machine, also known as plasma etching machine, plasma planar etching machine, plasma etching machine, plasma surface treatment instrument, plasma cleaning system, etc. Plasma etching is the most common form of dry etching, which works by exposing gas in the electronic region to form plasma. The resulting ionized gas and gas release high-energy electrons form plasma or ions. When ionized gas atoms are accelerated by an electric field, they release sufficient force to tightly adhere to the material or etch the surface with surface expulsion force. To some extent, plasma cleaning is essentially a milder form of plasma etching. The equipment used for dry etching process includes reaction chamber, power supply, and vacuum section. The workpiece is sent into the reaction chamber that is evacuated by the vacuum pump. Gas is introduced and exchanged with plasma. Plasma reacts on the surface of the workpiece, and the volatile byproducts of the reaction are pumped away by a vacuum pump. The plasma etching process is actually a reactive plasma process.

Application of vertical plasma etching machine:

1. Removing the adhesive residue caused by the melting of polymer materials on the metal surface of the hole wall due to high temperature during mechanical drilling and laser drilling of PCB circuit boards, especially suitable for applications where chemicals are difficult to enter laser drilling small holes.

2. HDI board: Plasma can remove carbides formed after laser drilling, etch and activate conductive holes, improve the yield and reliability of PHT process, and overcome the delamination of copper plating layer and copper material at the bottom of the hole.

3. FPC board: The removal of residual adhesive from the hole walls of multi-layer soft boards, surface cleaning and activation of reinforcement materials such as steel sheets, aluminum sheets, FR-4, etc., decomposition of carbides formed by laser cutting of gold fingers, and removal of dry film residues (removal of film clips) during fine line production can all be achieved through plasma surface treatment technology.

4. Cleaning of gold fingers and solder pad surfaces before chemical immersion/electroplating

5. Soft hard bonding board: Soft hard bonding board is composed of several materials with different thermal expansion coefficients laminated together. The connection between the hole walls and layers is prone to breakage and tearing. Using plasma technology to clean, roughen, and activate the materials can improve the reliability of hole metallization and the bonding force between the layers of the soft hard bonding board

6. Removal of adhesive residue from soft hard composite board

7. Coarsening, activation, and alteration of adhesion and bonding force on the inner surface

8. Teflon board: a high-frequency microwave board made of materials similar to Teflon. Due to its very low surface energy, plasma technology can be used to activate the hole walls and material surfaces, improve the bonding force between the hole walls and the copper plating layer, prevent black holes after copper deposition, eliminate high-temperature fracture and explosion of hole copper and inner layer copper, and improve the adhesion between solder mask ink and silk screen characters, effectively preventing solder mask ink and printed characters from falling off

9. BGA mounting: Prior to BGA mounting, plasma pretreatment is applied to the solder pads on the substrate to achieve a clean, roughened, and activated surface, greatly improving the success rate and reliability of BGA mounting.

10. After chemical immersion/electroplating of gold, clean the surface of the solder pads and gold fingers before SMT: improve solderability, eliminate virtual soldering and poor soldering, and enhance strength and reliability.

After-sales service

There are after-sales service teams in Guangdong, Suzhou, Chengdu, Zhengzhou and other places, responding quickly.

Warranty for 1 year. During the warranty period, if the equipment malfunctions (not caused by human factors), Party B shall arrange after-sales personnel to follow up and handle it until the fault is eliminated. After the warranty period (excluding non working hours and working days), the supplier shall provide free technical consultation and maintenance fees, and only charge relevant cost fees.